Intel Ships Panther Lake Chips Built With ASML High NA EUV
Intel has shipped selected Panther Lake processors made on Intel 18A with ASML High NA EUV lithography, Interesting Engineering reported, giving Intel production data while customer names, shipment volumes and wider node timing remain undisclosed.
Selected Panther Lake processors are now shipping with ASML High NA EUV lithography in high-volume manufacturing, as Interesting Engineering reported.
The commercial logic-product shipment covers a subset of Intel Core Ultra Series 3 processors made on the Intel 18A process.
At the Oregon site, selected 18A layers are dual-qualified on ASML's platform, with customer shipments matching yields on the existing NXE platform, according to the report.
Panther Lake Uses Selected Lithography Layers
The newer exposure tool is being introduced on chosen layers rather than across the full chip stack.
Intel and ASML stated that the production run is being used to gather manufacturing data and refine system setup, uptime and implementation before broader use in future nodes.
Interesting Engineering reported that Intel kept the existing Panther Lake production platform while adding the newer lithography step to generate manufacturing evidence.
The outlet described the milestone as a move from research and early testing toward production manufacturing.
ASML Tooling Moves From Installation To Output
ASML's role follows a 2024 system placement at the Hillsboro, Oregon, research and development site, records show.
The chipmaker later installed and qualified ASML's second-generation TWINSCAN EXE:5200B system, which the report characterized as offering higher throughput, better overlay accuracy and an upgraded light source.
Christophe Fouquet, ASML's president and chief executive, stated that the technology brings increased resolution and better process control for smaller and denser chip patterning.
Naga Chandrasekaran, executive vice president and general manager of Intel Foundry, added that the work shows how the newer EUV platform can be integrated into advanced semiconductor manufacturing at scale.
Wider Node Adoption Still Needs More Evidence
The milestone gives the foundry business production data for a lithography toolset expected to support denser chips and future AI-related computing demand.
The public material does not include customer names, shipment volume, wafer-output figures, cost impact, defect-rate comparisons or a dated schedule for using the toolset across additional process nodes.
For now, the source-backed development is narrower: selected 18A product layers are shipping in commercial high-volume logic products built with ASML's newer EUV platform.
Interesting Engineering did not report comparative yield data for the process.
