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Chips & SemiconductorsNews|May 27, 2026, 08:56 AM
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AMD Unveils US$10 Billion Taiwan AI Investment, Ramps Up TSMC 2nm Chip Production

BySendTech Times Chips & Compute DeskNewsroom-edited, source-reviewed coverage
Newsroom brief

AMD will invest over US$10 billion in Taiwan's AI supply chain. The investment focuses on advanced packaging technology and partnerships with local firms. Production of next-generation EPYC processors will utilize TSMC's 2nm technology.

Verified against source materialEdited by SendTech Times Chips & Compute DeskSource: Focus Taiwan
AMD Unveils US$10 Billion Taiwan AI Investment, Ramps Up TSMC 2nm Chip Production
Image source: AMD Chair and CEO Lisa Su (left) and TSMC Chairman C.C. Wei. Photo courtesy of AMD

AMD's Investment in Taiwan

U.S. semiconductor company AMD will invest more than US$10 billion in Taiwan's AI supply chain while ramping up production of its next-generation server processors using Taiwan Semiconductor Manufacturing Co's (TSMC) advanced 2-nanometer process technology.

This investment aims to expand partnerships with Taiwanese chip packaging, substrate, and server manufacturing companies as global demand for AI infrastructure continues to surge.

AMD Chair and CEO Lisa Su stated, "By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure." This highlights AMD's commitment to leveraging Taiwan's manufacturing capabilities alongside its own high-performance computing technologies to create advanced AI systems.

Focus on Advanced Packaging Technology

A major focus of the investment plan is advanced packaging technology for AI chips, including next-generation 2.5D bridge interconnect technology known as Elevated Fanout Bridge (EFB).

AMD is collaborating with Taiwan-based ASE Technology Holding Co. and Siliconware Precision Industries Co. (SPIL) to develop EFB packaging, which aims to improve chip interconnect bandwidth and power efficiency for future EPYC processors.

AMD has also achieved a milestone with Powertech Technology Inc. (PTI) by qualifying the industry's first 2.5D panel-based EFB interconnect, enabling more scalable and cost-efficient AI chip production.

Upcoming Helios AI Platform

The investments are also tied to AMD's upcoming Helios AI platform, described as a production-ready rack-scale AI infrastructure system scheduled for deployment beginning in the second half of 2026.

This platform is expected to play a crucial role in meeting the growing demand for AI capabilities across various sectors.

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