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Cadence Adds AuraStack AI Agent For PCB And Advanced Packaging Design
Chips & SemiconductorsNews
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Cadence Adds AuraStack AI Agent For PCB And Advanced Packaging Design

The Register reported that Cadence Design Systems introduced AuraStack, an agentic AI system for PCB and advanced packaging workflows. Cadence cited a 15x productivity claim and named Nvidia among customers, but The Register did not include pricing, availability dates, full customer names or independent benchmark results.

July 16, 2026Read More →
Thinking Machines Releases Inkling Open-Weights Model With 975 Billion Parameters
AINews
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Thinking Machines Releases Inkling Open-Weights Model With 975 Billion Parameters

SiliconANGLE reported that Thinking Machines Lab has released Inkling, its first foundation model, with full open weights and fine-tuning through Tinker. The account cited 975 billion total parameters, about 41 billion active parameters per average prompt and training on about 45 trillion tokens, while leaving customer deployments and independent benchmark validation undisclosed.

July 16, 2026Read More →
IMEC Outlines CMOS 2.0 Path As AI Compute Demand Rises
AINews
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IMEC Outlines CMOS 2.0 Path As AI Compute Demand Rises

CommonWealth Magazine English reported that IMEC's new CEO Patrick Vandenameele outlined semiconductor roadmap work tied to AI inference demand, CMOS 2.0 stacking, memory placement and optical interconnects. CommonWealth reported that Vandenameele estimated a 150-fold workload increase as AI shifts from training to inference, while TSMC's Kevin Zhang pointed to nanosheet, CFET and 3D stacking work.

July 15, 2026Read More →