onsemi Embeds Power Dies In Silicon For AI Rack And EV Systems

onsemi has introduced an Embedded Power Platform that puts heterogeneous power dies inside silicon and connects them through wafer-level redistribution layers, ServeTheHome reported.

The launch is aimed at a power-density problem that spans vehicle electrification, AI infrastructure and industrial systems.

Designers are being asked to deliver more power in tighter spaces while also managing heat, cost and efficiency.

Treating electrical, mechanical and thermal work as separate design tracks can push trade-offs late into development, where changes become more expensive.

EPP changes that package-level starting point.

Instead of relying on wire-bonded interconnects, the platform embeds power devices directly in silicon and uses redistribution layers to link them.

The result is a package architecture that is meant to co-design electrical behavior, heat flow and mechanical constraints from the beginning rather than tune each area after the fact.

The technical pitch centers on shorter and more controlled paths between devices.

Wafer-level metallization is intended to lower parasitic inductance, improve device control and allow faster switching frequencies. onsemi is also building drivers and controllers into the same package family, which can reduce the amount of surrounding system design needed for a power stage.

Thermal handling is the other half of the package argument.

Full-footprint thermal conduction gives heat a broader path out of the device, while high-voltage isolation inside the package reduces dependence on insulating materials that can limit heat flow.

Digital twin simulation and multi-physics co-optimization are part of the development workflow, letting engineers test electrical and thermal choices before committing to hardware builds.

The first named markets are automotive power electronics and AI power infrastructure.

For vehicles, the platform is framed around smaller and lighter traction inverters that can scale across future architectures.

For data centres, the same power-density pressure appears inside racks, where compact delivery systems are becoming part of the design challenge alongside accelerators, networking, storage and liquid cooling.

ServeTheHome highlighted an 800-volt AI rack use case involving an electromechanical breaker for several-hundred-kilowatt systems.

A smaller digital breaker using the EPP approach could combine cooling, control and telemetry in the assembly, addressing a different part of the rack power problem from busbars or other distribution hardware.

Subaru is the first disclosed strategic technology engagement partner.

The carmaker is receiving early access to engineering samples, simulation models and technical support as it evaluates whether the integrated design can improve efficiency and simplify development for next-generation vehicle architectures.

The partnership keeps EPP at the evaluation stage for automotive customers, while AI infrastructure gives onsemi a second early path for the same package technology.